发明名称 |
Process for manufacturing pressure-tight via connections |
摘要 |
The method involves manufacturing the through contacts in ceramic thin film substrates, whereby the through contacts are retrospectively applied to the substrate which is provided with through holes. The through holes are completely filled with an electrically conducting paste which is finally hardened by sintering. |
申请公布号 |
EP0906006(A3) |
申请公布日期 |
2000.06.14 |
申请号 |
EP19980116153 |
申请日期 |
1998.08.27 |
申请人 |
ROBERT BOSCH GMBH |
发明人 |
MOSER, MANFRED;SEIBOLD, ANNETTE;SCHUETZ, REINER |
分类号 |
H01L21/48;H05K1/03;H05K3/40 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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