发明名称 |
Process for forming fine thick-film conductor patterns |
摘要 |
A process for forming fine thick-film conductor patterns on a ceramic substrate which comprises the steps of forming grooves in a positive-working photoresist layer on the substrate by the photolithographic technology, filling the grooves with a conductive paste by squeezing with a squeegee, removing the photoresist layer by a wet process, and firing the remaining conductive paste pattern is improved. By the improvements, the conductive paste is squeezed into the grooves by the screen printing technique using a mask, and/or the solvent in the conducive paste consists essentially of one or more hydrocarbons, and/or the squeegee is made of a material having a flexural modulus in a range of 30-200 kgf/mm2. The formation of the grooves may be accomplished by laser beam machining; in this case a negative-working photoresist or any other soluble resin may be used to form the grooves therein. Also provided are a process for forming a fine thick-film conductor pattern by means of transfer of a conductive paste pattern formed on a support film to a green sheet, as well as a process for forming bumps on a ceramic circuit substrate.
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申请公布号 |
US6074893(A) |
申请公布日期 |
2000.06.13 |
申请号 |
US19970863279 |
申请日期 |
1997.05.27 |
申请人 |
SUMITOMO METAL INDUSTRIES, LTD.;SUMITOMO METAL CERAMICS INC. |
发明人 |
NAKATA, YOSHIKAZU;OTOMO, SYOZO;TANAKA, KAZUNARI;UNO, KOICHI |
分类号 |
H01L21/48;H05K1/03;H05K1/09;H05K3/12;H05K3/20;(IPC1-7):H01L21/44;H01L21/50 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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