发明名称 |
Method of centerless ground finishing of feedthrough pins for an implantable medical device |
摘要 |
A centerless grinding method of finishing feedthrough pins and corresponding devices for use in implantable medical devices and for components such as batteries in implantable medical devices is disclosed. The method provides certain advantages, including the elimination of longitudinal anomalies in drawn wire to thereby improve the hermeticity of implantable medical devices. In one of the preferred methods, the surface of an over-size medical grade wire having a known anomaly depth is centerless ground using an abrasive wheel and suitable coolant to a layer past which those anomalies disappear.
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申请公布号 |
US6076017(A) |
申请公布日期 |
2000.06.13 |
申请号 |
US19980022321 |
申请日期 |
1998.02.11 |
申请人 |
MEDTRONIC, INC. |
发明人 |
TAYLOR, WILLIAM J.;WRIGHT, JOHN D.;LESSAR, JOSEPH F.;LABREE, GARY F. |
分类号 |
A61N1/375;H01M2/06;H01M2/10;H01M2/30;H01M6/16;(IPC1-7):A61N1/375 |
主分类号 |
A61N1/375 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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