发明名称 |
Laser segmentation of plated through-hole sidewalls to form multiple conductors |
摘要 |
A method for generating multiple conductor segments within a plated through hole of a printed circuit board. The method utilizes laser light to define the segmented surfaces bounding a hole in a circuit board. Two embodiments of this method are a subtractive process and an additive process. The subtractive process starts with a plated through hole and uses a laser to removes vertical strips of the PTH conductive lining to form the multiple conductive segments. The additive process applies a seeding material to a bare hole in a circuit board, removes vertical strips of the seeding material via laser scanning, and applies an electrically conductive material to the seeded surfaces to form the multiple conductive segments.
|
申请公布号 |
US6073344(A) |
申请公布日期 |
2000.06.13 |
申请号 |
US19990239384 |
申请日期 |
1999.01.28 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JAPP, ROBERT M.;KRESGE, JOHN S. |
分类号 |
H05K3/02;H05K3/18;H05K3/40;(IPC1-7):H05K3/36 |
主分类号 |
H05K3/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|