| 摘要 |
PROBLEM TO BE SOLVED: To lap precisely by regulating the polishing amount of a workpiece partially, in response to the polishing state of the workpiece in a lapping. SOLUTION: This device is provided with a disc shape lap surface plate 10 to which a polishing liquid is supplied and provided turnably, one or more holders 15 for holding a workpiece and pressing the workpiece for the lap surface plate 10, a support shaft 13 provided in an erection state for the lap surface plate 10 and supporting the holder 15, an oscillation mechanism F oscillating and turning the support shaft 13 around its axis, a base board 11 supported turnably the support shaft 13 around its axis, and a base board swing mechanism for reciprocating this base board 11 in the diameter direction of the lap surface plate 10 or in the nearly parallel direction with the diameter direction. |
