发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To excellently cut a thick plate by restricting expansion of a laser light even in a remote area in an optical axis moving type laser processing device. SOLUTION: On an optical of a laser light LB, the laser light LB is reflected by an incident bend mirror 15, and is incident on a curvature variable mirror 13 at an regulation angle regulated in advance, for example, at an incident angle θ of 10 deg. or less. Thereby, for the reason of a spherical aberration and the like, deterioration (degradation) of beam quality of the laser light LB ejected from the mirror 13 is prevented, and the beam diameter is changed/adjusted by the curvature variable mirror 13. Since the incident bend mirror 15 and the curvature variable mirror 13 are integrally constituted as a mirror block 17, they are easily assembled in any place on the optical path of the laser light LB.
申请公布号 JP2000158172(A) 申请公布日期 2000.06.13
申请号 JP19980342196 申请日期 1998.12.01
申请人 AMADA ENG CENTER CO LTD;AMADA CO LTD 发明人 SAKO HIROSHI;NAKAMURA ATSUSHI
分类号 B23K26/00;B23K26/06;B23K26/073;B23K26/08;B23K26/38;G02B5/10;G02B7/198;G02B17/08;G02B27/09 主分类号 B23K26/00
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