| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless plating device by which a plating film is formed in uniform thickness, and the contamination or blotting due to the useless oxidation, reduction, corrosion reaction, drying of the locally deposited soln. or the like, depending on the quality of the deposited soln. is never caused. SOLUTION: A substrate 20 to be plated is electroless-plated by this method. The device is provided with a plating soln. circulating tank 15, a plating soln. circulating pump 17 and switching valves (stop valves V1 to V8), the substrate 20 is placed in an electroless-plating tank 10, and an electroless plating soln. Q1 is supplied from the tank 15, the soln. Q1 is completely isolated from the outside air, and an electroless plating film is formed on the substrate 20 surface in a closed state. The substrate 20 in the plating tank 10 is not exposed to the outside air and is plated, washed with water and dried in series.
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