| 摘要 |
PROBLEM TO BE SOLVED: To suppress the warpage of a target and to facilitate the peeling exchange of both of the target and backing plate by inserting a thermally conductive adhesive into the center of an assembled body obtd. by joining a target and a backing plate, interposing a low m.p. metal into the space between the adhesive and the target and/or between the adhesive and the backing plate and adhering them. SOLUTION: An ITO target 1 essentially consisting of about >=70 wt.% indium oxide and tin oxide and a backing plate 5 of high purity copper are joined to form an oxide sintered body sputtering target assembled body. At this time, an adhesive 3 of a thermally conductive resin (such as an Ag epoxy resin) is inserted into the center of both, also, the backing plate 5 and the ITO target 1 are coated with low m.p. metals 4 and 2 such as indium or the like by heating and melting them, the adhesive 3 joinable at ordinary temp. is interposed into the space of the faces on which the backing plate 5 and the ITO target 1 are coated with the low m.p. metals 4 and 2, and adhesion is executed.
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