| 发明名称 |
Mounting method of semiconductor device |
| 摘要 |
A bump electrode made of an alloy of two or more kinds of metals is formed on an electrode pad portion of a semiconductor device by the laser ablation method and the bump electrode is reflow-soldered to electrically bond the bump electrode to a terminal electrode section on a circuit board. The semiconductor device and the terminal electrode section are encapsulated in resin by the laser ablation method.
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| 申请公布号 |
US6074894(A) |
申请公布日期 |
2000.06.13 |
| 申请号 |
US19970919036 |
申请日期 |
1997.08.27 |
| 申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
SUETSUGU, KENICHIRO;YAMAGUCHI, ATSUSHI |
| 分类号 |
B23K26/00;C23C14/28;H01L21/56;H01L21/60;H01L23/31;H01L23/485;H05K3/04;H05K3/28;H05K3/34;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
B23K26/00 |
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