Caro's cleaning of SOG control wafer residue

摘要

A new method of recycling a spin-on-glass control wafer by removing spin-on-glass residue from the control wafer surface is described. A silicon control wafer is provided having a spin-on-glass layer coated thereon. The spin-on-glass layer is removed using a hydrofluoric acid dip wherein a silk-like spin-on-glass residue 15 remains on the silicon control wafer surface. The silicon control wafer surface is cleaned with a Caro's dip whereby the spin-on-glass residue is removed. Thereafter, the silicon control wafer can be reused.