| 摘要 |
PROBLEM TO BE SOLVED: To eliminate requirement for replacing or cleaning a polishing surface plate by constituting this device with the polishing surface plate, an abrasive pad, a wafer carrier, and a supply pipe, dividing the abrasive pad as an inner ring and an outer ring which have different material, and providing a different hardness. SOLUTION: This device comprises a rotating polishing surface plate 32, an abrasive pad 34 arranged on the polishing surface plate 32, a wafer carrier 36 on which a wafer 38 is loaded, and supply pipes 40a, 40b for supplying slurries 42a, 42b from upside of the abrasive pad 34. The abrasive pad 34 is provided with an inner ring 34a having a first abrasive force and an outer ring 34b having a second abrasive force, for example, diameter of the inner ring 34a is 20 inch, and outer circle's radius of the outer ring 34b is 26 inch, namely width of the outer ring 34b is 6 inch. For example, the inner ring 34a is made of a soft material, and the outer ring 34b is made of a material having high hardness. Thus, first and second steps of polishing can be performed on the polishing surface plate 32. |
