发明名称 POLISHING FLUID COMPOSITION
摘要 <p>PROBLEM TO BE SOLVED: To prepare a polishing fluid composition capable of improving polishing speed without causing surface defect on the surface of an polishing object and capable of reducing surface roughness by including (A) a chelating compound, (B) partially esterified and/or etherified compounds of polyhydric alcohol and (C) water. SOLUTION: This polishing fluid composition includes (A) a chelating compound (preferably an aminocarboxylic acid) or its salt, (B) partially esterified and/or etherified compounds of polyhydric alcohol (preferably a sucrose ester) and (C) water. The composition preferably includes (D) abrasive (abrasive grain such as alumina grain or silicon carbide one). The contents of the ingredients A, B and C are preferably 0.05-20 wt.% and 50-99.9 wt.% respectively. When the ingredient D is included, it is blended in an amount of 0.01-40 pts.wt. based on 100 pts.wt. of the weight of the composition comprising the ingredients A, B and C.</p>
申请公布号 JP2000160142(A) 申请公布日期 2000.06.13
申请号 JP19980336416 申请日期 1998.11.27
申请人 KAO CORP 发明人 TAIRA KOJI;FUJII SHIGEO;OOSHIMA YOSHIAKI
分类号 B24B37/00;C09K3/14;G11B5/84;H01L21/304;(IPC1-7):C09K3/14 主分类号 B24B37/00
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