发明名称 ADHESIVE COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain an adhesive composition with reduced melt viscosity and improved productivity and processability, useful as a hot-melt adhesive or the like by including a styrene-based block copolymer and a specific random copolymer. SOLUTION: This adhesive composition comprises (A) a styrene-based block copolymer and (B) a random copolymer composed mainly of an aromatic vinyl compound unit and isobutylene unit in the weight ratio A/B of pref. (100:1) to (1:100). In this case, it is recommended that the component A is such one as to have polymer block composed of an aromatic vinyl compound as hard segment, especially a block copolymer made from an aromatic vinyl compound and a conjugated diene, or a hydrogenated product thereof, or the like.
申请公布号 JP2000160121(A) 申请公布日期 2000.06.13
申请号 JP19980334183 申请日期 1998.11.25
申请人 KURARAY CO LTD 发明人 KITAYAMA KOJI;TAKAMATSU HIDEO;MAEDA MIZUHO;YAMADA TSUTOMU;SHIYAJI KENJI;ONO TOMOHIRO
分类号 C09J123/22;C09J125/00;C09J153/00;(IPC1-7):C09J153/00 主分类号 C09J123/22
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