| 摘要 |
PROBLEM TO BE SOLVED: To obtain the subject molding material free from any halogen and antimony, excellent in flame retardancy and moldability, and useful in electronic component devices, etc., by compounding a blend of respectively specific epoxy resins. SOLUTION: This molding material essentially comprises (A) a blend of (i) an epoxy resin of formula I and (ii) a 2nd epoxy resin of formula II, (B) a curing agent, (C) an inorganic filler, and (D) a flame retardant free from any halogen and/or antimony in the weight ratio i/ii of (20:80) to 80:20); wherein the component C accounts for 80-92 wt.% of this molding material as a whole, and it is preferable that the component B includes a curing agent of formula III [R is H or a (substituted) 1-10C hydrocarbon; n is 0-8], and the component D is a metal hydroxide, esp. magnesium hydroxide and its amount to be included being <=100 pts.wt. based on 100 pts.wt. of the component A.
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