| 摘要 |
<p>PROBLEM TO BE SOLVED: To reduce a moving distance and a moving time by arranging two transportation members in series, using one of them for receiving a wafer from a notch polishing portion and transporting it to an initial peripheral-surface polishing device of each system, and using another of them for receiving the wafer from a final peripheral- surface polishing device of each system and transporting it to a discharge portion. SOLUTION: Transportation members 51, 52 are arranged in series in the Y direction in a central part. The transportation member 51 receives a wafer from a wafer handling portion 21, and supplies it to a wafer inversion mechanism of a wafer inversion member. The transportation member 52 receives the polished wafer from the wafer inversion mechanism and transports it to a discharge portion. Therefore, the transportation member 51 is constituted just so that it can move between the wafer handling portion 21 and a handling portion to the wafer inversion mechanism, and the transportation member 52 is constituted just so that it can move between the receiving portion from the wafer inversion mechanism and a handling portion of the discharge portion. Widths of two transportation members 51, 52 are provided only with a width of one transportation member. Thus, a moving distance and a moving time can be reduced, and the width of a polishing portion itself can be reduced.</p> |
