| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electroless silver plating soln. for electronic parts having a migration preventive effect and by which the service life of a plating bath is prolonged. SOLUTION: This plating soln. consists of a silver salt, a fluoric surfactant and a pH buffer salt. Silver nitrate is used as the silver salt, and >=1 kind between succinimide and phthalimide is used as a silver complexing agent. The soln. contains 0.05-30 g/l silver ion, 0.1-200 g/l >=1 kind between succinimide and phthalimide and 0.01-10 g/l fluorine surfactant and further contains an inorg. acid, an org. acid or both as the pH buffer salt.
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