发明名称 Inspection device for inspecting a semiconductor wafer
摘要 The invention provides a simple, light-weight inspection device by arranging a mechanical path switching mechanism. The invention includes a device main body, one or more inspection targets having a plurality of connection pads, a test portion for measuring the electrical characteristics of the inspection targets on the basis of electrical signals from the inspection targets, a mounting device for mounting the inspection targets at predetermined positions with respect to the device main body, a probe card having a plurality of probe pads on its upper surface, which are electrically connected to the connection pads of the inspection targets mounted on the mounting device through an electrical contact device, a contact block having contact pins which removably contact the respective probe pads of the probe card, a connection device for electrically connecting the contact pins of the contact block and the test portion, and a contact block support/moving device for movably supporting the contact block in the circumferential direction at the peripheral of the probe card. In the invention, the plurality of probe pads are divided into a plurality of groups, which are circumferentially arranged at peripheral portions of the upper surface of the probe card.
申请公布号 US6075373(A) 申请公布日期 2000.06.13
申请号 US19970862601 申请日期 1997.05.23
申请人 TOKYO ELECTRON LIMITED 发明人 IINO, SHINJI
分类号 G01R31/26;G01R1/06;G01R1/073;G01R31/28;H01L21/66;(IPC1-7):G01R31/02;G01R1/04 主分类号 G01R31/26
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