| 摘要 |
PROBLEM TO BE SOLVED: To prevent deterioration of print and eliminate processing by forming a circuit on a substrate, printing solder resist thereon, forming at least one metal film on metal wiring formed into a circuit and then performing ink jet printing onto the solder resist film thereby eliminating the need of plate making. SOLUTION: After a circuit of metal, e.g. copper, is formed on a printed board in etching process 1, solder resist is formed in solder resist coating process 2 at a desired part of the circuit by printing or UV-curing through pattern exposure. Subsequently, at least one layer of metal coating is formed on the copper wiring of the printed wiring board by solder coating, or the like, in solder processing process 4, plating process 5 or composite process 6 of solder processing and plating. Finally, a symbol mark is printed on the solder resist in ink jet print process 7. |
