发明名称 |
DECORATIVE TAPE BONDED MOLDING |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a decorative tape bonded molding capable of obtaining sufficient fusion strength between a molding main body and a decorative tape even under a high temp. atmosphere. SOLUTION: A decorative tape bonded molding is constituted by integrally fusing a decorative tape 16 to a molding main body 14. A molding main body molding material is a non-polar TPE compsn. and the decorative tape 16 is constituted by providing a decorative layer 22 between a transparent resin film layer 20 and a backing layer 18 and a backing layer forming material is a resin compsn. containing a resin polymer same to the hard phase forming polymer of non-polar TPE or a fusible resin polymer having an m.p. of 100 deg.C or higher.</p> |
申请公布号 |
JP2000158592(A) |
申请公布日期 |
2000.06.13 |
申请号 |
JP19980338132 |
申请日期 |
1998.11.27 |
申请人 |
TOYODA GOSEI CO LTD |
发明人 |
SATO KOICHI;ITO KATSUSHI;KOIZUMI JUNJI;NADA SADAO;ICHIOKA TETSUYOSHI |
分类号 |
B29C45/14;B32B25/08;B32B27/30;B44C1/14;B44C1/18;B44C3/04;B60R13/02;B60R13/04;B60R19/44;(IPC1-7):B32B25/08 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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