| 摘要 |
PURPOSE: A mounting method of driving integrated circuit of thin-film micromirror array-actuated(TMA) mounts a driving integrated circuit(IC) in a driving substrate by using a flip-chip method, so as to prevent plural pads of the driving substrate from being opened and the entire area from being increased. CONSTITUTION: Plural pads formed on an integrated circuit(IC)-mounted part correspond to plural pads of an IC(180a,180b). Plural auxiliary pads(260) formed on a transparent substrate(210) connects the plural pads of the IC(180a,180b) with plural pads(150) of a driving substrate(50). The plural pads are connected with the plural auxiliary pads(260), respectively. The plural pads(150) of the driving substrate(50) are connected with the plural auxiliary pads(260) of the transparent substrate(210) by the wire bonding, respectively, after the driving substrate(50) including an AMA panel(160) and the pads(150) are mounted in an aperture(250) of the transparent substrate(210). The source driving IC(180a) is mounted in the row direction of the AMA panel(160) and the gate driving IC(180b) is mounted in the column direction of the AMA panel(160). Exactly, an adhesive layer connects the plural pads of an IC(180a,180b) with the plural pads of the IC-mounted part. Therefore, the driving IC(180a.180b) is electrically connected to the pads(150) of the driving substrate(50).
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