发明名称 PROCESS FOR DEPOSITING CONDUCTING LAYER ON SUBSTRATE
摘要 A process for forming a conductive layer on a substrate, comprising the steps of depositing ink on the substrate by means of lithographic printing to form a seeding layer, and depositing a first electrically conducting layer on the seeding layer by electroless deposition.
申请公布号 WO0033625(A1) 申请公布日期 2000.06.08
申请号 WO1999GB04064 申请日期 1999.12.03
申请人 BRUNEL UNIVERSITY;LOCHUN, DARREN;HARRISON, DAVID;RAMSEY, BLUE, JOHN 发明人 LOCHUN, DARREN;HARRISON, DAVID;RAMSEY, BLUE, JOHN
分类号 C23C18/20;C25D7/00;H05K1/09;H05K3/12;H05K3/18;H05K3/24;H05K3/32;(IPC1-7):H05K1/09 主分类号 C23C18/20
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