摘要 |
<p>An apparatus for the inspection of objects or leaded objects such as integrated circuit packages (10) comprising top view imaging sensors (25) for top view inspection and for side inspection, a triangle-shaped track (11), the base of which supports the packages, with the apex of the triangle in an inverted pyramid position. The two adjacent faces of the triangle at the apex are mirror finished. The packages are guided from opposite sides of the inspection station by two lipped guides (12), the bottom-inside surfaces of the lips having an acute angle from the horizontal. The packages are lit by side view diffused light sources (18) on each side of the track and/or by top view light sources (14). The portions of the leads of the packages (20) protruding along the corners of the track are seen by imaging sensors, and the top surface (35) is seen by a top imaging sensor (16). The output signals are processed in a computer (30) for displaying the view on a display screen (32).</p> |
申请人 |
RAHMONIC RESOURCES PTE LTD.;CHUANG, PING, DERG;HO, CHOON, LEONG;SIM, WEE, LEE;LEE, CHOON, GIAP;NG, BOON, LONG;NEO, KEE, CHEN, GEORGE;SEAH, CHEE, HIAN |
发明人 |
CHUANG, PING, DERG;HO, CHOON, LEONG;SIM, WEE, LEE;LEE, CHOON, GIAP;NG, BOON, LONG;NEO, KEE, CHEN, GEORGE;SEAH, CHEE, HIAN |