| 摘要 |
<p>A composition for removing sidewalls which comprises an aqueous solution containing both nitric acid and at least one carboxylic acid compound selected from the group consisting of polycarboxylic acids, aminocarboxylic acids, and salts of these; a method of removing sidewalls; and a process for producing a semiconductor device. Use of the composition is effective in removing sidewalls at a low temperature in a short time in semiconductor device production without corroding the wiring material, e.g., an aluminum alloy. Thus, a semiconductor device having an aluminum alloy wiring which has undergone substantially no corrosion can be efficiently produced.</p> |
