发明名称 THERMAL HEATING BOARD
摘要 An improved hydronic radiant heating system (10) comprising a nonstructural board (12) having a recess (14) formed in one surface (16) of board (12), and a pipe (18) located within recess (14). If desired, a film of metal (20) can be applied to surface (16) of board (12) with a thickness proportional to the thermal properties of board (12) to provide desired overall thermal characteristics for heating system (10).
申请公布号 WO0032991(A2) 申请公布日期 2000.06.08
申请号 WO1999US28728 申请日期 1999.12.02
申请人 WARM BROTHERS, INC.;MUIR, ROBERT, MORGAN 发明人 MUIR, ROBERT, MORGAN
分类号 F24D3/16;(IPC1-7):F24D/ 主分类号 F24D3/16
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