发明名称 Electronic pressure sensor component
摘要 The invention concerns an electronic sensor component (1) with a base (2) and comprising a chip carrier (4) which has a relatively flat chip carrier surface (3) on or in which is mounted at least one semiconductor chip (5) with an intergrated sensor circuit, the axis (6) of the sensor having a predetermined orientation. The sensor component also comprises a fixing element (8) which is shaped or positioned on the edge of the base (2) and projects beyond the periphery of the chip carrier (4) to allow the sensor component (1) to be shape-mated with, frictionally engaged with or substance-fitted to or in an external housing. The integrated sensor circuit is electroconductively connected to at least two electrode terminals (10) guided through the base (2). A protecting cap (11) made from expandable material and overreaching the semiconductor chip (5) with the integrated sensor circuit is permanently fixed to the base (2) of the sensor component (1), the protecting cap (11) being shaped or arranged so that when placing or fastening the protecting cap (11) on the base (2), the fixing element (8) which projects beyond the periphery of the chip carrier (4) is freed.
申请公布号 GB2330418(B) 申请公布日期 2000.06.07
申请号 GB19990002303 申请日期 1997.07.31
申请人 * SIEMENS AKTIENGESELLSCHAFT 发明人 GUNTER * EHRLER
分类号 G01L9/00;H01L29/84;(IPC1-7):G01L9/00 主分类号 G01L9/00
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