| 摘要 |
An interconnection or active element (3) is formed on a substrate (1), and an electrode pad (5) is formed on the interconnection or active element (3) with an interlayer insulating film (4) therebetween. A projected electrode (7) is formed on the surface of the electrode pad (5) for protecting the interconnection or active element (3) during bonding to an external terminal. <IMAGE> |
