发明名称 Tin electroplating process
摘要 <p>An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.</p>
申请公布号 EP1006217(A1) 申请公布日期 2000.06.07
申请号 EP19990309320 申请日期 1999.11.23
申请人 LUCENT TECHNOLOGIES INC. 发明人 CHIU, SEE HONG;ZHANG, YUN
分类号 C25D3/32;C25D3/60;(IPC1-7):C25D3/32 主分类号 C25D3/32
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