发明名称 |
Tin electroplating process |
摘要 |
<p>An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.</p> |
申请公布号 |
EP1006217(A1) |
申请公布日期 |
2000.06.07 |
申请号 |
EP19990309320 |
申请日期 |
1999.11.23 |
申请人 |
LUCENT TECHNOLOGIES INC. |
发明人 |
CHIU, SEE HONG;ZHANG, YUN |
分类号 |
C25D3/32;C25D3/60;(IPC1-7):C25D3/32 |
主分类号 |
C25D3/32 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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