发明名称 Apparatus for cutting labels from a web and bonding said labels to objects
摘要 <p>It is a main object of the present invention to provide an improved bonding apparatus for cutting a separator-unprovided label continuum in which labels have been continuously formed to a predetermined length and bonding each label strip thus obtained to an object. The bonding apparatus includes a first feeding means (32) for feeding a label continuum (10) including non-separator labels continuously formed at predetermined intervals and an adhesive layer (16) of delayed tack type formed on a rear surface thereof; a cutting means (38) for cutting the label continuum fed by the first feeding means (32) to a predetermined length to form a label strip; an activating device for heating the adhesive agent of the delayed tack type; a second feeding means (40) for feeding the label strip formed by the cutting operation of the cutting means; and a bonding means (134) for bonding the label strip fed by the second feeding means to the object. <IMAGE></p>
申请公布号 EP1006052(A1) 申请公布日期 2000.06.07
申请号 EP20000100214 申请日期 1995.09.12
申请人 OSAKA SEALING PRINTING CO., LTD. 发明人 MATSUGUCHI, YUTAKA
分类号 B65C9/18;B65C9/25;(IPC1-7):B65C9/18 主分类号 B65C9/18
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