发明名称 LASER BEAM MACHINING DEVICE WITH MICROSCOPE
摘要 PROBLEM TO BE SOLVED: To improve productivity without suffering from generation of worked defects by enabling removal of machined refuse even in case of generation of machined refuse through laser beam machining of a work piece. SOLUTION: In a laser beam machining device with microscope provided with a sample stage 1 on which a workpiece is placed, a microscope to visibly recognize the workpiece through an objective lense provided to a upper part thereof, and a laser beam machining means 6 to execute machining of the workpiece by using laser beam based on the result of the visible recognition, a first charging means 2 to charge the sample stage 1 on a first electric potential, an adsorptive surface 4 arranged around an objective lense 3, and a second charging means 5 to charge the adsorptive surface 4 on a second electric potential with a different polarity from the first electric potential.
申请公布号 JP2000153386(A) 申请公布日期 2000.06.06
申请号 JP19980328927 申请日期 1998.11.19
申请人 SONY CORP 发明人 NOBO FUMIYOSHI
分类号 H01L21/302;B23K26/02;B23K26/14;B23K26/16;H01L21/3065;(IPC1-7):B23K26/16;H01L21/306 主分类号 H01L21/302
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