发明名称 |
Method and system for electrical coupling to copper interconnects |
摘要 |
A system and method for providing electrical connection to a copper interconnect through a via hole is disclosed. The copper interconnect includes a surface having impurities. The method and system include chemically reducing the copper oxide and removing the carbon atoms at the surface. The chemical etching is performed using a reactive species. The reactive species reacts with the impurities on the surface of the copper interconnect to remove the impurities.
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申请公布号 |
US6071813(A) |
申请公布日期 |
2000.06.06 |
申请号 |
US19970954974 |
申请日期 |
1997.10.20 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
NOGAMI, TAKESHI |
分类号 |
H01L21/311;H01L21/3213;H01L21/768;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/311 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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