发明名称 ROTARY SUBSTRATE TREATING DEVICE
摘要 PROBLEM TO BE SOLVED: To almost uniformalize the feed quantity of a treating liquid per the unit surface area of a substrate over the whole surface of the substrate even when the substrate is large-sized. SOLUTION: The rotary substrate treating device is provided with a freely rotatable substrate rotary table 2, on which the substrate is placed horizontally, a treating liquid feed pipe 9 provided with plural nozzles 7a-7e in the axial direction and arranged above the substrate rotary table 2 and a rotary driving motor for rotating the substrate rotary table 2. The surface treatment of the substrate is performed by feeding the treating liquid from the nozzles 7a-7e toward the substrate 1 with the rotation of the substrate rotary table 2. In such rotary substrate treating device, the diameter of each nozzle 7a-7e is increased with the increase of the distance from the rotation center of the substrate 1.
申请公布号 JP2000153210(A) 申请公布日期 2000.06.06
申请号 JP19980329116 申请日期 1998.11.19
申请人 HITACHI LTD 发明人 TOGASHI MORINORI;ABE YASUO;AZUMA HITOSHI
分类号 B05D1/40;B05C11/08;G03F7/16;G03F7/30;H01L21/027;H01L21/304 主分类号 B05D1/40
代理机构 代理人
主权项
地址