| 摘要 |
PROBLEM TO BE SOLVED: To bond a conductor wiring film and an insulating resin layer with high strength while patterning the wiring finely by forming a build-up wiring part only in a specified region of a printed wiring board. SOLUTION: After a conductor wiring layer 102 is formed on a core wiring board 101, an insulating resin layer 103 is applied thereon and then unnecessary part thereof is removed in developing process. Subsequently, a conductor wiring film 105 is formed using a sputtering mask opened at a part for depositing the conductor wiring film 105 and then the sputtering mask is removed. Thereafter, photoresist 106 is applied on the entire surface and subjected to anisotropic dry etching to form conductor wiring 109 thus forming build-up wiring 107 only in a required part. According to the method, the conductor wiring and the photo via can be patterned finely and the conductor wiring layer 102 and the an insulating resin layer 103 can be bonded with high strength. |
