摘要 |
PROBLEM TO BE SOLVED: To obtain a printed wiring board excellent in connection property and reliability by preventing stripping of insulating resin buried in a through hole. SOLUTION: A printed wiring board 43 having a substrate 1 and through holes 6 formed in the substrate 1 is provided. In this printed wiring board 43, the inner wall of the through hole 6 is formed of a metal base layer 10, a roughened surface 9 is formed on the surface of the metal base layer 10, and the through hole 6 is filled with insulating resin 12. The metal base layer 10 is closely in contact with the insulating resin 12, and contains a metal layer, which is heat-treated. Before the roughened surface 9 is formed, the surface of the metal layer has glossiness of 1.0-1.4.
|