发明名称 PRINTED WIRING BOARD, BODY TO BE TREATED, AND MANUFACTURE OF PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a printed wiring board excellent in connection property and reliability by preventing stripping of insulating resin buried in a through hole. SOLUTION: A printed wiring board 43 having a substrate 1 and through holes 6 formed in the substrate 1 is provided. In this printed wiring board 43, the inner wall of the through hole 6 is formed of a metal base layer 10, a roughened surface 9 is formed on the surface of the metal base layer 10, and the through hole 6 is filled with insulating resin 12. The metal base layer 10 is closely in contact with the insulating resin 12, and contains a metal layer, which is heat-treated. Before the roughened surface 9 is formed, the surface of the metal layer has glossiness of 1.0-1.4.
申请公布号 JP2000156551(A) 申请公布日期 2000.06.06
申请号 JP19980331399 申请日期 1998.11.20
申请人 IBIDEN CO LTD 发明人 TAKENAKA YOSHINORI
分类号 H05K1/11;H05K3/38;H05K3/40;(IPC1-7):H05K1/11 主分类号 H05K1/11
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