发明名称 POWER SUPPLY PATTERN CONNECTING STRUCTURE OF ELECTRONIC CIRCUIT PARTS
摘要 PROBLEM TO BE SOLVED: To prevent the flow of second high-frequency current to electronic circuit parts and reduce the electromagnetic noise from the circuit board. SOLUTION: There are provided an IC 2 mounted on a printed circuit board 1, a wiring pattern consisting of first power supply patterns 41, 42 that are connected to each of two terminals, a power supply pin 21 and a ground pin 22 of the IC 2, and allow supply current from a supply power layer 11 and a ground layer 12 and first ground patterns 43, 44 and a bypass capacitor 3 connected to this wiring pattern and mounted on the surface of the printed circuit board 1 on which IC 2 is mounted on the backside. The power supply layer 11 is connected with a second power supply pattern 45 provided between the power supply layer 11 and one end of the bypass capacitor 3 via a via hole 53. The ground layer 12 is connected with the first ground patterns 43, 44 via a via hole 54.
申请公布号 JP2000156548(A) 申请公布日期 2000.06.06
申请号 JP19980331095 申请日期 1998.11.20
申请人 YASKAWA ELECTRIC CORP 发明人 YAMAZAKI SADAAKI;GYOTOKU TOMOJI;SONODA SUMITOSHI
分类号 H05K1/11;H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/11
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