| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin excellent in soldering heat resistance, and also a prepreg and a laminate using the same. SOLUTION: The resin composition comprises, as essential components, (A) a bisphenol A epoxy resin having an epoxy equivalent of 1,500 to 3,000, (B) a bisphenol A epoxy resin having an epoxy equivalent of 200 to 700, (C) a novolac-epoxy resin, and (D) a curing agent. A prepreg and a laminate or a metallic foil-attached laminate make use of the composition.
|
