| 发明名称 |
Multi-chip packaging structure having chips sealably mounted on opposing surfaces of substrates |
| 摘要 |
In a method for manufacturing an electronic apparatus, an electronic component is mounted on an organic substrate within its cavity. The electronic component is sealed by a concave molded resin enveloper filled into the cavity.
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| 申请公布号 |
US6072122(A) |
申请公布日期 |
2000.06.06 |
| 申请号 |
US19980038535 |
申请日期 |
1998.03.11 |
| 申请人 |
NEC CORPORATION |
发明人 |
HOSOYA, FUTOSHI |
| 分类号 |
H01L23/28;H01L23/24;H01L25/04;H01L25/065;H01L25/07;H01L25/16;H01L25/18;H05K3/28;(IPC1-7):H01L23/02;H05K5/06 |
主分类号 |
H01L23/28 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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