发明名称 Process for forming a semiconductor device with controlled relative thicknesses of the active region and gate electrode
摘要 In a semiconductor device fabrication process, a first semiconductor device is constructed with a gate electrode and an active (e.g., source/drain) region. The thickness of the active region is determined. A second semiconductor device is constructed with the same gate electrode and active region dopant concentrations as the first device and is generally the same as the first device except for the thickness of the gate electrode. Using the determined thickness of the active region of the first device, the thickness of the gate electrode of the second device is controlled so that it differs from the thickness of the active region of the second device by a desired amount.
申请公布号 US6071749(A) 申请公布日期 2000.06.06
申请号 US19970995024 申请日期 1997.12.19
申请人 ADVANCED MICRO DEVICES, INC. 发明人 MAY, CHARLES E.;DAWSON, ROBERT
分类号 H01L21/28;H01L21/336;H01L21/66;(IPC1-7):H01L21/66 主分类号 H01L21/28
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