发明名称 |
VINYL ESTER RESIN COMPOSITION HAVING LOW SHRINK PROPERTIES |
摘要 |
PROBLEM TO BE SOLVED: To provide a vinyl ester resin composition having low shrink properties which forms a molding bringing extremely little shrink when it cures. SOLUTION: A vinyl ester resin composition having low shrink properties comprises a vinyl ester and/or a monomer copolymerizable with the vinyl ester wherein a thermoplastic resin having a functional group of at least 400 [(MPa)1/2 cm3mol-1] of cohesive energy parameter F is compounded as a low shrinking agent, a filler and a curing agent. The thermoplastic resin is a polystyrene resin or a poly(meth)acrylate resin, and the specified functional group is preferably a hydroxyl group, a carboxyl group or an amino group.
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申请公布号 |
JP2000154295(A) |
申请公布日期 |
2000.06.06 |
申请号 |
JP19980331412 |
申请日期 |
1998.11.20 |
申请人 |
SHOWA HIGHPOLYMER CO LTD |
发明人 |
CHIYOU ISHIYUU;WATANABE MINORU;TANAKA SHIGEO;HAYASHI SHINICHIRO |
分类号 |
C08K3/12;C08F2/18;C08F2/22;C08K3/22;C08K3/26;C08K3/36;C08K5/098;C08K5/14;C08L25/06;C08L25/08;C08L31/02;C08L33/08;C08L33/10;C08L101/02;(IPC1-7):C08L31/02 |
主分类号 |
C08K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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