发明名称 VINYL ESTER RESIN COMPOSITION HAVING LOW SHRINK PROPERTIES
摘要 PROBLEM TO BE SOLVED: To provide a vinyl ester resin composition having low shrink properties which forms a molding bringing extremely little shrink when it cures. SOLUTION: A vinyl ester resin composition having low shrink properties comprises a vinyl ester and/or a monomer copolymerizable with the vinyl ester wherein a thermoplastic resin having a functional group of at least 400 [(MPa)1/2 cm3mol-1] of cohesive energy parameter F is compounded as a low shrinking agent, a filler and a curing agent. The thermoplastic resin is a polystyrene resin or a poly(meth)acrylate resin, and the specified functional group is preferably a hydroxyl group, a carboxyl group or an amino group.
申请公布号 JP2000154295(A) 申请公布日期 2000.06.06
申请号 JP19980331412 申请日期 1998.11.20
申请人 SHOWA HIGHPOLYMER CO LTD 发明人 CHIYOU ISHIYUU;WATANABE MINORU;TANAKA SHIGEO;HAYASHI SHINICHIRO
分类号 C08K3/12;C08F2/18;C08F2/22;C08K3/22;C08K3/26;C08K3/36;C08K5/098;C08K5/14;C08L25/06;C08L25/08;C08L31/02;C08L33/08;C08L33/10;C08L101/02;(IPC1-7):C08L31/02 主分类号 C08K3/12
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