| 摘要 |
PROBLEM TO BE SOLVED: To effectively prevent the heat of an electronic cooling element from acting on an optical semiconductor device and to always control the optical semiconductor device at a proper temperature, even by the low-output electronic cooling element to make it possible to actuate the optical semiconductor device normally and stably extending over a long period. SOLUTION: This package comprises a substrate 1 having a mounting part 1a with the optical semiconductor device 4 mounted on the upper surface thereof via an electronic cooling element 5, a frame 2 which is attached on the base body 1 in such a way as to encircle the mounting part 1a and has a through hole 2a in the side part on one side of the side parts thereof and a notch part 2b on the other side part thereof, a cylindrical fixing member 9 which is attached in the through hole 2a or on the frame 2 on the periphery of the hole 2a and is bonded to an optical fiber member 11, a ceramic terminal body 6 which is insertedly attached in the notch part 2b and is provided with an insulator 7 formed with metallized wiring layers 8 which are electrically connected with each electrode on the device 4, and a cover member 3 which is attached on the upper surface of the frame 2 and hermetically seals the device 4. In this case, the insulator 7 of the terminal body consists of a glass ceramic sintered body.
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