发明名称 RESIN COMPOSITION FOR GLASS EPOXY COPPER-CLAD LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide an epoxy resin composition excellent in flame retardancy, heat resistance, moisture resistance, moldability or the like, suitable for a glass epoxy copper-clad laminate, not including any harmful halogen such as fluorine, chlorine and bromine, and also excellent in flame retardancy and safety. SOLUTION: This epoxy resin composition consists of (A) an epoxy resin not including any halogen element, (B) a nitrogen-including phenolic novolak resin, (C) an aromatic condensed phosphate, (D) an inorganic filler and (E) a curing accelerator as essential ingredients. The content of the ingredient C is 5-30 wt.% based on the total weight of the above resin composition. The resin composition is used for producing a glass epoxy copper-clad laminate which is produced by impregnating a glass substrate with the epoxy resin composition, drying it to form prepreg, laminating plural sheets of the prepreg, by superimposing copper foil on at least one surface of the sheets and by molding them so as to be unified.
申请公布号 JP2000154301(A) 申请公布日期 2000.06.06
申请号 JP19980330345 申请日期 1998.11.20
申请人 TOSHIBA CHEM CORP 发明人 TSUCHIYA SHINJI
分类号 H05K1/03;C08K3/00;C08K5/521;C08L61/06;C08L63/00;C08L63/04;(IPC1-7):C08L63/00 主分类号 H05K1/03
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