发明名称 SOLDERED ARTICLE
摘要 PROBLEM TO BE SOLVED: To provide a soldered article using a solder which is difficult to cause electrode corrosion, excellent in soldering property, free from Ag, and excellent in material cost. SOLUTION: In a soldered article in which a parts having a Cu conductor is bonded with a solder, the solder having the composition consisting of, by weight, 0.1-2.0% Cu, 1.0-7.5% Bi and the balance Sn is used. In addition, the composition of Cu in the solder is 0.5-1.3%. The composition of Bi in the solder is 1.0-3.0%.
申请公布号 JP2000153388(A) 申请公布日期 2000.06.06
申请号 JP19990226682 申请日期 1999.08.10
申请人 MURATA MFG CO LTD 发明人 TAKAOKA HIDEKIYO;HAMADA KUNIHIKO;TOKUDA TAMOTSU
分类号 B23K35/26;B23K101/36;C22C13/02;(IPC1-7):B23K35/26 主分类号 B23K35/26
代理机构 代理人
主权项
地址