| 摘要 |
PROBLEM TO BE SOLVED: To efficiently dissipate heat which is generated at the operation of a semiconductor device to the outside to always keep the device at a proper temperature, and operate the device normally and stably extending over a long period. SOLUTION: This package is formed into a structure, wherein a metallic frame 2 is made to attach on a heat sink 1 having a mounting part 1a with a semiconductor device 4 mounted on the main surface thereof in such a way as to encircle the mounting part 1a and with notch parts 2a provided in the frame 2, and ceramic terminal bodies 7 are made to insertedly attach in the notch parts 2a, respectively. The frame 2 consist of an iron-nickel-cobalt alloy or an iron-nickel alloy, metal layers 6 having a three-layer structure consisting of a chrome-iron alloy layer 6a, a copper layer 6b and an iron-nickel alloy layer or an iron-nickel-cobalt alloy layer 6c are respectively adhered on both of the upper and lower surfaces of a core body 1b consisting of an unidirectional composite material formed by bonding carbon fibers arranged in the thickness direction of the heat sink with carbon by diffusion joining to form the metal layers 6 on both of the upper and lower surfaces of the core body 1b and the thickness of each of the layer 6a, the layer 6b an the iron-nickel alloy layer or the layer 6c is formed in a roughly the same thickness. |
