WAFER SEPARATING METHOD AND BACK PLATE FOR SLICE

摘要

PROBLEM TO BE SOLVED: To easily separate a wafer sheet by sheet from a head by simply continuous work in ingot slice work by a wire saw. SOLUTION: A slit 42 is formed in a main unit of a back plate 28 fixing a head 24 and an ingot 10 for cutting the semiconductor ingot 10 by a wire saw. The wire saw is moved to the slit 42 formed on an extension line in a slice direction in the back plate fixing the ingot to the head 24, so as to separate a wafer from the head.