| 摘要 |
PROBLEM TO BE SOLVED: To easily form a contact part flush, and to reduce deformation by arranging the specific number of contact bodies having the spherical surface in a part of a recessed part formed by the bottom surface having a suction port and a peripheral wall, and chucking a chucking object by making point contact of a back face of the sucking object with the spherical surface of the contact bodies. SOLUTION: A hollow part 11 of the lower part of a head body 10 is communicated with a vacuum pump through a pipe 12, and a chucking port is formed in the upper surface of the head body 10 to be communicated with the hollow part 11 through an air vent 14. An annular wall 15 is formed on the peripheral edge of the upper surface of the head body 10, and spherical contact bodies 17 having a diameter equal to a height of the annular wall 15 and filled by at least three pieces at equal intervals in a recessed part 16 of the head body 10 defined by the annular wall 15. When air of the hollow part 11 is chucked by the vacuum pump, a space defined by the head body 10, a semiconductor wafer W and the spherical contact bodies 17 becomes negative pressure, so that the semiconductor wafer W is chucked to the vacuum chucking head 10 in a state of being received by the surface (a point) of the spherical contact bodies 17 and the upper surface of the annular wall 15. |
