| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for semiconductor sealing, which is excellent not only in low stress property but also in humidity-resistant reliability an nonflammability and also free from producing any problems of environmental pollution and the like. SOLUTION: This resin composition for semiconductor sealing contains each component of the component of (A) a thermosetting resin, the component of (B) a hardener, the component of (C) a polyhedron-shaped compound metallic oxide, which is shown by a formula of m(MaOb).n(QdOc).cH2O [In the formula, the M and the Q are different metallic elements, the Q is the metallic element belonging to the group selected from among a group IVa, a group Va, a group VIa, a group VIIa, a group VIII, a group Ib and a group IIb in the periodic law table and the (m), the (n), the (a), the (b), the (c), the (d) and the (e) are a positive number and may be the same value and may be different values.] and the component of (D) butadiene rubber grains. |
