| 摘要 |
PROBLEM TO BE SOLVED: To improve a solder resistance, moisture-resistance reliability, a flame retardation property, and fluidity by allowing a resin composition for sealing semiconductor to contain a thermosetting resin, a curing agent, a compound metal hydroxide in a specific polyhedron shape and a curing accelerator. SOLUTION: A resin composition for sealing semiconductor is allowed to contain a thermosetting resin, a curing agent, a compound metal hydroxide in a polyhedron shape that is expressed by an expression of m (MaOb).n(QdOe).cH2O (M and Q are mutually different metal elements, Q is a metal element that is selected from Iva, Va, Via, VIIa, VIII, Ib, and IIb in a periodic table, and m, n, and a-e are positive numbers), and one curing accelerator that is selected from a group consisting of tetra substitution phosphonium/tetra substitution boletol, diazabicycloalkene, and a tertiary amine expressed by a general expression. However, in the expression, R1 is an alkylene group, R2, R3, and R4 are an alkyl group, where R2-R4 are the same values or different values. |
