发明名称 CIRCUIT MODULE COUPLING TYPE OF ELECTRONIC CIRCUIT DEVICE AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To favorably reduce variations of the relative positions of the bottom for cooling of each circuit module, the topside for mounting of a circuit board on the second stage, the main surface of a connecting terminal, etc. SOLUTION: A coupling member 4 has a function of coupling each circuit module 1 with the next by press fitting, and a function of bearing a control circuit board 14 on the second stage by the topside for circuit board fast sticking to which a circuit board 1a is to stick fast. This way, the adhesion between the control circuit board 14 on the second stage where each circuit module 1 is mounted and the topside for circuit board fast sticking of each coupling member 4 bearing it is automatically improved by controlling the quantity of press fitting into the circuit module 1 of each coupling member 4, so a two- stage type of electronic circuit device which has a plurality of circuit modules can be materialized by simple constitution. Moreover, the backside of the circuit board 1a of each circuit module 1 can be leveled into the same plane at the same time with the leveling of the topside of the coupling member 4, by press.
申请公布号 JP2000156575(A) 申请公布日期 2000.06.06
申请号 JP19980330803 申请日期 1998.11.20
申请人 DENSO CORP 发明人 ISHIYAMA HIROSHI
分类号 H05K7/14;H01L25/07;H01L25/18;(IPC1-7):H05K7/14 主分类号 H05K7/14
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