| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat pipe which can cool a body to be cooled, even in a top heat mode. SOLUTION: In a heat pipe device in a top heat mode wherein a heat pipe has a heat absorbing area 3a connected to the side of a body 1 to be cooled (semiconductor element), in the upper part, and a radiating area 3b connected to the side of a cooling structure, in the lower part, and these areas are connected by a plurality of flow passages 3c between them, a heater 4 is provided for several passages selected out of the flow passages 3c, at a position near the radiating area 3b, and reflux of an internal working liquid is generated by heating of the heater 4.
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