| 摘要 |
The invention relates to a process for attaching a demountable flexible module to a circuit board, and includes the following steps: providing a circuit board having at least one, preferably a plurality, of gold plated metal balls disposed thereon; providing a flexible module having at least one, preferably a plurality, of gold plated vias disposed therein; positioning an elastomer stop over the circuit board; positioning the flexible module over the balls; applying pressure to the flexible module for a time sufficient to form a line contact between the gold plating on the vias and the gold plating on the metal ball of the circuit board, wherein the module is removable without heating the module. The process does not use solder to attach the module to the board, and requires substantially less than 2000 psi, and preferably less than 400 psi, to attach the module which produces little, if any, deformation to the flexible module.
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