| 摘要 |
<p>PROBLEM TO BE SOLVED: To easily inspect the defect of a chip by providing a recessed hole where one portion of the terminal part of a flip chip to be mounted is fitted to at a second surface side that opposes the first surface of a rigid wiring substrate for a via hole part through the rigid wiring substrate and the entire portion of a fine wiring part. SOLUTION: A fine wiring part 120 where fine wiring 125 consisting of a one-layer metal thin film is laminated via an insulation layer 121 is provided on a first surface 110A of a single-layer rigid substrate 110, where wiring layers 115 and 116 are provided on both the surfaces of an insulation layer 111. Then, in a via hole part 160 through the rigid wiring substrate 110 and the entire portion of the fine wiring part 120, one portion of the terminal part of a flip chip to be mounted is fitted, and a recessed hole 161 for retaining a terminal part at the side surface position is provided at a second surface side that opposes the first surface 110A of the rigid wiring substrate 110, thus inspecting the defect of a chip easily.</p> |
